Tingbo He, president of Huawei's chip-design subsidiary HiSilicon, announced at the IEEE International Symposium on Circuits and Systems that the company has developed a novel method to optimize semiconductors, aiming to close the performance gap between Chinese and Western chips. This new approach, termed Tau's Scaling Law, shifts focus from increasing the number of components on chips to enhancing computational speed across entire systems. He promised that Huawei would demonstrate the effectiveness of this method with a new chip by winter 2026. The announcement comes amid ongoing U.S. export controls that limit Huawei's collaboration with leading chip manufacturers, forcing the company to innovate within the constraints of its domestic supply chain. He indicated that the company has found ways to advance chip performance beyond traditional scaling methods, potentially reshaping the competitive landscape in the semiconductor industry.
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Huawei's Chip Queen Unveils Innovative Semiconductor Optimization Strategy
Wired· Will Knight· Thursday, May 28, 2026
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